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AMD
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XC17S30VO8I

Manufacturer Part Number:
XC17S30VO8I
Manufacturer / Brand
AMD
Part of Description:
IC PROM SER 300K 8-SOIC
Datasheets:
XC17S30VO8I(1).pdfXC17S30VO8I(2).pdfXC17S30VO8I(3).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC17S30VO8I
Manufacturer / Brand AMD
Category Integrated Circuits (ICs) > Memory - Configuration Proms for FPGAs
Description IC PROM SER 300K 8-SOIC
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 4.5V ~ 5.5V
Supplier Device Package 8-TSOP
Series -
Programmable Type OTP
Package / Case 8-SOIC (0.154", 3.90mm Width)
Package Tube
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Memory Size 300kb
Base Product Number XC17S30

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



XC17S30VO8I Product Details:

Title: Understanding XC17S30VO8I: An Integrated Circuit Memory for FPGA Configuration Proms The XC17S30VO8I is an integrated circuit memory of Configuration Proms for FPGAs. This high-performance memory chip is designed to program FPGAs with ease and accuracy, making it an ideal choice for a wide range of electronic applications. With a model number of XC17S30VO8I, this memory chip has some remarkable features. The main features of this chip include its 300k-bit memory, 8-SOIC package, and intelligent design. This chip is compatible with various systems and can handle high data rates, making it highly efficient. As for its performance parameters, the XC17S30VO8I boasts of an output voltage of 1.8V, a current of 40 mA, and a power rating of 72 mW. It also has an accuracy of +/- 5% and an excellent operating temperature range of -40°C to +85°C. These features make it ideal for use in various electronic devices and industries. One of the main application scenarios of this memory chip is for FPGA Configuration Proms. It is also useful in other electronic applications such as in automotive, telecommunications, and aerospace industries, to name a few. This chip is highly versatile, and its usage is not limited. Different types of integrated circuits exist, such as digital, analog, mixed signal, and RF. The XC17S30VO8I belongs to the digital category, which has complex manufacturing processes. It goes through chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The manufacturing process of this chip is precise and requires sophisticated equipment to ensure that the ICs produced are high-quality. Finally, finished products need to undergo appropriate packaging and testing to ensure component quality. Given its nature as an integrated circuit, it requires various tests like Burn-in, ESD, and latch-up testing to meet the required standards. In summary, the XC17S30VO8I is an essential integrated circuit memory chip for FPGA configuration Proms. Its high-performance features, versatile usage, and intelligent design make it a popular choice for various industries. With a complex manufacturing process and required testing standards, this memory chip is highly reliable and efficient for electronic applications.

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